Wireless component manufacturer Nordic Semiconductor introduces a Bluetooth® Smart system-on-chip that handles complex processes with minimal power use. U.S.-based developer and engineering firm Rigado presents a pre-certified, comprehensive Bluetooth® Smart module using Nordic’s SoC to deliver a secure, cost-effective solution to IoT developers.
Nordic Semiconductor’s new system-on-chip is set to revolutionize development for the Internet of Things. On Oct. 5, Nordic launched the Global Tech Tour in Boston, Mass. to introduce the nRF52832 system-on-chip, an ultralow power Bluetooth® Smart solution that can handle complex multivalent processes while maintaining ultralow power consumption. The nRF52 is the basis of Rigado’s newest Bluetooth® Low Energy module, the BMD-300, an easy-to-implement component that shortens IoT developers’ time to market and reduces development costs.
The Global Tech Tour visits thirty cities, including nine in the U.S. The free presentations will feature a thorough introduction of the nRF52 chipset family, along with presentations on RF connectivity and layout, power devices, software development kits and more. Attendees will receive a free nRF52 development kit
The nRF52 is an ultralow power multiprotocol system-on-chip that supports Bluetooth® Smart, ANT and 2.4GHz ULP wireless applications. The chipset is Nordic’s smallest Bluetooth® Smart SoC to date, measuring just 3.0 x 3.2 mm, and is the first Nordic SoC to feature near field communication (NFC) protocol, allowing developers to implement “touch-to-pair” functionality in their designs. Its comprehensive digital and analog interfaces and peripherals address a variety of Bluetooth® Smart design requirements, including digital audio processing, FFT/FIR and security algorithms, driving device displays and user interfaces.
Rigado, a provider of embeddable Bluetooth® Smart modules, is an early adopter of the nRF52 for its next generation of Bluetooth® Smart modules, the BMD-300 and will have a presence at the Seattle, Portland, San Jose and Orange County Tech Tour stops. The BMD-300 is an integrated system-on-module that includes a comprehensive set of RF components, along with all of the features of the nRF52, allowing developers to forgo engineering design and costs when producing wireless products. The module is pre-certified and tested, and it includes added security, libraries and firmware to protect customers’ products, lower their development costs and shorten their time to market. Samples are scheduled to be available in Q4 with production quantities available in early Q1 2016.
Rigado also helps customers seeking assistance with design or chip-down solutions by offering complete, multidisciplinary engineering services and expertise in low power and wireless designs. Rigado provides electrical, industrial, mechanical, software and application engineering to support customers from concept to production.
For more information on the nRF52, visit
Learn more about and register for the Global Tech Tour at https://www.nordicsemi.com/eng/Events/Global-Tech-Tour-2015/US.